图
Forward Current Relative Luminous Intensity
IF = f (VF); TA = 25 C IV/IV(30mA) = f (IF); TA = 25 C
Reflow Soldering Instructions (回流焊说明)
1.Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and Second soldering process.
(本产品最多只可回焊两次,且在首次回焊后须冷却至室温之后方可进行第二次回焊.)
2.When soldering,